| 发明名称 |
Polishing pad for chemical mechanical polishing process and chemical mechanical polishing apparatus including the same |
| 摘要 |
A chemical mechanical polishing apparatus includes a platen configured to support and rotate a wafer, and a polishing pad facing the platen. The polishing pad includes a body having a groove with a rotational symmetric pattern. |
| 申请公布号 |
US8734206(B2) |
申请公布日期 |
2014.05.27 |
| 申请号 |
US201113036496 |
申请日期 |
2011.02.28 |
| 申请人 |
CHANG ONE-MOON;BOO JAE-PHIL;TAK SOO-YOUNG;AHN JONG-SUN;KIM SHIN;KANG KYOUNG-MOON;SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
CHANG ONE-MOON;BOO JAE-PHIL;TAK SOO-YOUNG;AHN JONG-SUN;KIM SHIN;KANG KYOUNG-MOON |
| 分类号 |
B24B1/00 |
主分类号 |
B24B1/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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