发明名称 |
LAMINATED BODY, LAMINATED BOARD, MULTI-LAYER LAMINATED BOARD, PRINTED WIRING BOARD, AND PRODUCTION METHOD FOR LAMINATED BOARD |
摘要 |
<p>A laminate body containing at least one resin composition layer and at least one glass substrate layer, wherein the resin composition layer comprises a resin composition containing a thermosetting resin and an inorganic filler. A laminate plate containing at least one cured resin layer and at least one glass substrate layer, wherein the cured resin layer comprises a cured product of a resin composition that contains a thermosetting resin and an inorganic filler. A printed wiring board having the laminate plate and a wiring provided on the surface of the laminate plate. A method for producing a laminate plate containing at least one cured resin layer comprising a cured product of a resin composition containing a thermosetting resin and an inorganic filler, and at least one glass substrate layer, which comprises a cured resin layer forming step of forming a cured resin layer on the surface of a glass substrate.</p> |
申请公布号 |
KR20140063710(A) |
申请公布日期 |
2014.05.27 |
申请号 |
KR20147007227 |
申请日期 |
2012.09.20 |
申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
AOSHIMA MASAHIRO;TAKAHASHI YOSHIHIRO;YAMAZAKI YUKA;KAMIGATA YASUO;MURAI HIKARI |
分类号 |
B32B17/10;B32B27/20;H05K1/03;H05K3/46 |
主分类号 |
B32B17/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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