发明名称 LAMINATED BODY, LAMINATED BOARD, MULTI-LAYER LAMINATED BOARD, PRINTED WIRING BOARD, AND PRODUCTION METHOD FOR LAMINATED BOARD
摘要 <p>A laminate body containing at least one resin composition layer and at least one glass substrate layer, wherein the resin composition layer comprises a resin composition containing a thermosetting resin and an inorganic filler. A laminate plate containing at least one cured resin layer and at least one glass substrate layer, wherein the cured resin layer comprises a cured product of a resin composition that contains a thermosetting resin and an inorganic filler. A printed wiring board having the laminate plate and a wiring provided on the surface of the laminate plate. A method for producing a laminate plate containing at least one cured resin layer comprising a cured product of a resin composition containing a thermosetting resin and an inorganic filler, and at least one glass substrate layer, which comprises a cured resin layer forming step of forming a cured resin layer on the surface of a glass substrate.</p>
申请公布号 KR20140063710(A) 申请公布日期 2014.05.27
申请号 KR20147007227 申请日期 2012.09.20
申请人 HITACHI CHEMICAL COMPANY, LTD. 发明人 AOSHIMA MASAHIRO;TAKAHASHI YOSHIHIRO;YAMAZAKI YUKA;KAMIGATA YASUO;MURAI HIKARI
分类号 B32B17/10;B32B27/20;H05K1/03;H05K3/46 主分类号 B32B17/10
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