发明名称 POLISHING PAD, MANUFACTURING METHOD THEREFOR, AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
摘要 <p>A polishing pad having a polishing layer comprising a thermoset polyurethane foam, wherein the thermoset polyurethane foam contains, as raw material components, an isocyanate component, and active-hydrogen-containing compounds, and the active-hydrogen-containing compounds comprise one or more polyol compounds (each) having two or more functional groups, and a monool compound having one functional group.</p>
申请公布号 KR101399519(B1) 申请公布日期 2014.05.27
申请号 KR20127022940 申请日期 2011.03.17
申请人 发明人
分类号 B24B37/24;C08G18/30;C08G101/00;H01L21/304 主分类号 B24B37/24
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