| 发明名称 |
THERMALLY CONDUCTIVE, MOISTURE-CURABLE RESIN COMPOSITION |
| 摘要 |
<p>The present invention relates to a thermally conductive, moisture-curable composition capable of efficiently conducting heat for components that involve heat generation. The present invention relates to a thermally conductive, moisture curable resin composition comprising (A) an organic polymer containing two or more cross-linkable hydrolyzable silyl groups, (B) a thermally conductive filler, and (C) a polyether compound having a cross-linkable hydrolyzable silyl group at only one terminal.</p> |
| 申请公布号 |
KR20140063722(A) |
申请公布日期 |
2014.05.27 |
| 申请号 |
KR20147007477 |
申请日期 |
2012.09.14 |
| 申请人 |
THREE BOND FINE CHEMICAL CO., LTD. |
发明人 |
MATSUKI TAKASHI;ADACHI MAMORU;MAEDA YASUO;FUJISAWA TSUNETOSHI;MOTOKI SHIGEKAZU;IDE MIYOKA |
| 分类号 |
C08L101/10;C08G81/00;C08K3/00;C08L71/02;H01L23/36;H01L23/373 |
主分类号 |
C08L101/10 |
| 代理机构 |
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