发明名称 |
HEAT DISSIPATION SYSTEM FOR POWER MODULE |
摘要 |
The present invention relates to a heat dissipation system for a power module, comprising a heat dissipation member made of an insulating material, which has one surface and the other surface and incudes a through hole for forming a metal layer on the one surface, a first inlet formed on the other surface, a second inlet formed in a direction perpendicular to one end of the first inlet, and a cooling medium flow path formed between the one surface and the other surface to be connected to the second inlet. |
申请公布号 |
KR20140063162(A) |
申请公布日期 |
2014.05.27 |
申请号 |
KR20120130187 |
申请日期 |
2012.11.16 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
OH, KYU HWAN;KWAK, YOUNG HOON |
分类号 |
H01L23/46 |
主分类号 |
H01L23/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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