发明名称 HEAT DISSIPATION SYSTEM FOR POWER MODULE
摘要 The present invention relates to a heat dissipation system for a power module, comprising a heat dissipation member made of an insulating material, which has one surface and the other surface and incudes a through hole for forming a metal layer on the one surface, a first inlet formed on the other surface, a second inlet formed in a direction perpendicular to one end of the first inlet, and a cooling medium flow path formed between the one surface and the other surface to be connected to the second inlet.
申请公布号 KR20140063162(A) 申请公布日期 2014.05.27
申请号 KR20120130187 申请日期 2012.11.16
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 OH, KYU HWAN;KWAK, YOUNG HOON
分类号 H01L23/46 主分类号 H01L23/46
代理机构 代理人
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