发明名称 |
Material for forming electroless plate, coating solution for adhering catalyst, method for forming electroless plate, and plating method |
摘要 |
A material for forming electroless plate shows favorable catalyst adhering property, and shows no delamination of catalyst adhering layer from non-conductive base material, no dissolution of catalyst adhering layer into a plating solution, and no discoloration of interface of plate layer with catalyst adhering layer during the catalyst adhering step, development step and other steps. The material includes a non-conductive base material and a catalyst adhering layer, provided on the non-conductive base and including a water-insoluble polyester resin The catalyst adhering layer shows a contact angle of 60° or smaller to purified water. |
申请公布号 |
US8734958(B2) |
申请公布日期 |
2014.05.27 |
申请号 |
US20080525469 |
申请日期 |
2008.02.01 |
申请人 |
OHTA TETSUJI;KITAMURA KEIKO;WATANABE MITSUHIRO;KIMOTO CO., LTD.;KANTO GAKUIN UNIVERSITY SURFACE ENGINEERING RESEARCH INSTITUTE |
发明人 |
OHTA TETSUJI;KITAMURA KEIKO;WATANABE MITSUHIRO |
分类号 |
B32B5/00;B32B5/16;B32B15/04;B32B15/08;B32B15/09;B32B27/14;B32B27/36 |
主分类号 |
B32B5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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