发明名称 |
Electronic component |
摘要 |
An electronic component is configured to include a laminate disposed between first and second magnetic substrates. The laminate is formed by laminating resin insulating layers, a coil pattern, and a lead pattern. The coil pattern is connected to external electrodes disposed on end surfaces of the laminate by using internal electrodes. The electronic component further includes expansion relaxation portions disposed in the inside of the resin insulating layers and located in the vicinity of connection regions of the internal electrodes and the external electrodes. The expansion relaxation portions are formed by using a magnetic powder resin in which a ferrite powder and a resin material are mixed. |
申请公布号 |
USRE44911(E1) |
申请公布日期 |
2014.05.27 |
申请号 |
US201213533764 |
申请日期 |
2012.06.26 |
申请人 |
MATSUDA KATSUJI;KAWAGUCHI MASAHIKO;MURATA MANUFACTURING CO., LTD. |
发明人 |
MATSUDA KATSUJI;KAWAGUCHI MASAHIKO |
分类号 |
H01F5/00;H01F27/28;H01F27/29 |
主分类号 |
H01F5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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