发明名称 Radiation hardened FinFET
摘要 The embodiments of the invention provide a structure and method for a rad-hard FinFET or mesa. More specifically, a semiconductor structure is provided having at least one fin or mesa comprising a channel region on an isolation region. A doped substrate region is also provided below the fin, wherein the doped substrate region has a first polarity opposite a second polarity of the channel region. The isolation region contacts the doped substrate region. The structure further includes a gate electrode covering the channel region and at least a portion of the isolation region. The gate electrode comprises a lower portion below the channel region of the fin, wherein the lower portion of the gate electrode comprises a height that is at least one-half of a thickness of the fin.
申请公布号 US8735990(B2) 申请公布日期 2014.05.27
申请号 US20070679869 申请日期 2007.02.28
申请人 ANDERSON BRENT A.;DENNARD ROBERT H.;HAKEY MARK C.;NOWAK EDWARD J.;INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 ANDERSON BRENT A.;DENNARD ROBERT H.;HAKEY MARK C.;NOWAK EDWARD J.
分类号 H01L21/70;H01L27/085;H01L29/06 主分类号 H01L21/70
代理机构 代理人
主权项
地址