发明名称 Small size light emitting device and manufacturing method of the same
摘要 There is provided a light emitting device including: a package body having first and second circumferential surfaces and a plurality of side surfaces formed therebetween, the package body defined into first and second level areas including the first and second circumferential surfaces, respectively; first and second external terminal blocks each having an electrical contact part; an LED chip disposed between the first and second external terminal blocks in the first level area and having an electrode surface where first and second electrodes are formed; and wires electrically connected to first and second electrodes of the LED chip to the electrical contact parts of the first and second external terminal blocks, respectively.
申请公布号 US8735935(B2) 申请公布日期 2014.05.27
申请号 US201113070014 申请日期 2011.03.23
申请人 INOUE TOMIO;TSUTSUI TSUYOSHI;YOON JAE JOON;SHIN OK HEE;SAMSUNG ELECTRONICS CO., LTD 发明人 INOUE TOMIO;TSUTSUI TSUYOSHI;YOON JAE JOON;SHIN OK HEE
分类号 H01L33/00;H01L33/50;H01L33/54;H01L33/56;H01L33/60;H01L33/62 主分类号 H01L33/00
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