发明名称 |
Small size light emitting device and manufacturing method of the same |
摘要 |
There is provided a light emitting device including: a package body having first and second circumferential surfaces and a plurality of side surfaces formed therebetween, the package body defined into first and second level areas including the first and second circumferential surfaces, respectively; first and second external terminal blocks each having an electrical contact part; an LED chip disposed between the first and second external terminal blocks in the first level area and having an electrode surface where first and second electrodes are formed; and wires electrically connected to first and second electrodes of the LED chip to the electrical contact parts of the first and second external terminal blocks, respectively. |
申请公布号 |
US8735935(B2) |
申请公布日期 |
2014.05.27 |
申请号 |
US201113070014 |
申请日期 |
2011.03.23 |
申请人 |
INOUE TOMIO;TSUTSUI TSUYOSHI;YOON JAE JOON;SHIN OK HEE;SAMSUNG ELECTRONICS CO., LTD |
发明人 |
INOUE TOMIO;TSUTSUI TSUYOSHI;YOON JAE JOON;SHIN OK HEE |
分类号 |
H01L33/00;H01L33/50;H01L33/54;H01L33/56;H01L33/60;H01L33/62 |
主分类号 |
H01L33/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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