| 摘要 |
<p>A metal filling apparatus fills molten metal into a minute space formed on a surface of a semiconductor wafer. The apparatus has a processor body with a chamber in which the wafer is held, a molten metal supply, and a molten metal recovery mechanism. The supply includes a tank in which molten metal is stored, a supply pipe connected between the chamber and the tank, a supplier interposed in the supply pipe to supply molten metal from the tank to the processing chamber, and the recovery mechanism recovers molten metal from the processing chamber.</p> |
