| 摘要 |
Disclosed are a substrate treatment device and a substrate treatment method. The substrate treatment device, which aligns substrates and masks to perform processes for the substrates, comprises a substrate loading chamber in which a plurality of substrates are sequentially loaded; a substrate rotating chamber for rotating the substrates transferred from the substrate loading chamber; first and second alignment chambers located in both sides of the substrate rotating chamber and aligning the substrates and the masks; a mask rotating chamber which is connected to the first and second alignment chambers; a mask loading chamber which has one end connected to the mask rotating chamber to consecutively supply the masks to the mask rotating chamber; and a process chamber which is connected to the other end of the mask loading chamber to perform the processes for the substrates. The substrate treatment device is able to reduce a total process tact-time and improve the efficiency of materials used in the process of treating the substrates. |
