| 摘要 |
<p>880,233. Joining metals by electro-deposition. SIEMENS & HALSKE A.G. Nov. 5, 1959 [Nov. 5, 1958], No. 37585/59. Class 41. [Also in Group XXII] In soldering two metal members, the members are held with the portions to be joined adjacent, these portions are immersed in a melt containing at least one metal compound and a potential is applied between the members and the melt so that metal capable of forming a solder is electrolytically deposited on the members, the temperature of the melt being equal to or above the melting point of the deposited metal. The lower end of an iron housing 1, for a semiconductor component 3, having press fitted therein an iron bush 2 through which passes a lead through insulator, is immersed in a melt 4, at a temperature of 150-300‹ C., preferably 260‹ C. containing 6% cadmium chloride, 56% indium monochloride and 38% zinc chloride. The housing is connected to the negative pole of a voltage source of 10-20 volts and the melt is connected to the positive pole by a tungsten electrode 6 and a current of 40 amps. per square cm. is passed. A liquid layer of an indium-cadmium alloy coats the metal parts and penetrates by capillary attraction into the interior of the joint to form a vacuum tight seal when the housing is withdrawn. The anode may alternatively be a melt of the metal to be deposited or of carbon and large amplitude current pulses may be superimposed on the direct current. The members to be joined may form an acute, Fig. 2a, an obtuse or a right angle with one another.</p> |
