发明名称 HIGH MODULUS COMPOSITE FOR EMI SHIELDING
摘要 PURPOSE: A high modulus composite for EMI shielding is provided to be suitable for the EMI shielding by having high conductivity and low surface resistance. CONSTITUTION: A highly-rigid electromagnetic interference shielding composite comprises a thermoplastic resin(10) and a carbon fiber(20). The length of the carbon fiber is 8-20mm. The carbon fiber is 45-65 parts by weight of a whole composite. A thermoplastic resin is a crystallizable thermoplastic resin.
申请公布号 KR101397687(B1) 申请公布日期 2014.05.23
申请号 KR20100129508 申请日期 2010.12.16
申请人 发明人
分类号 B32B15/08;H05K9/00 主分类号 B32B15/08
代理机构 代理人
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