| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an inexpensive and recyclable slice table for ingot which enables the ingot to be adhesively fixed to the slice table in short time by high-frequency induction heating while suppressing energy loss, and also provide an expensive slice table for ingot that is excellent in cutting performance.SOLUTION: A slice table 2 for ingot 1 which is used to manufacture wafer 3 is provided. A first slice table 2 is obtained by molding molding material 4 containing carbon material and binder material. The volume specific resistivity of the slice table 2 is not more than 0.1Ωm. A second slice table 2 is obtained by molding molding material 4 containing filler and binder material. The molding material 4 contains the binder material of 100 pts.mass and the filler of 250 pts.mass or more. The filler comprises powder material having the maximum particle diameter of 1 mm or less. The binder material is formed of any material selected from unsaturated polyester resin, vinyl ester resin, phenol resin and epoxy resin.</p> |
