发明名称 MODULE STRUCTURE
摘要 Disclosed is a module structure including a front sheet, a back sheet, and an optotronic device disposed between the front sheet and the back sheet. A first encapsulate layer is disposed between the optotronic device and the front sheet. A second encapsulate layer is disposed between the optotronic device and the back sheet. The back sheet is a layered structure of a hydrogenated styrene elastomer resin layer and a polyolefin layer, wherein the hydrogenated styrene elastomer resin layer is disposed between the second encapsulate layer and the polyolefin layer.
申请公布号 US2014140012(A1) 申请公布日期 2014.05.22
申请号 US201313790743 申请日期 2013.03.08
申请人 INSTITUTE INDUSTRIAL TECHNOLOGY RESEARCH;KUO HSIN TECHNOLOGY CO., LTD.;INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE 发明人 WANG WEN-HSIEN;KUAN MIN-TSUNG;LEE TZONG-MING;CHOU WEN-HSIEN;LIN FU-MING;LEE WEN-KUEI;YEH CHIN ZENG;CHEN MING-HUNG
分类号 H05K5/02 主分类号 H05K5/02
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