| 摘要 |
PROBLEM TO BE SOLVED: To provide an in-situ monitoring system with monitoring of an elongated region.SOLUTION: A method of chemical mechanical polishing a substrate 10 includes: polishing a layer on the substrate at a polishing station; monitoring the layer during polishing at the polishing station with an in-situ monitoring system 160, the in-situ monitoring system monitoring an elongated region and generating a measured signal; computing an angle between a primary axis of the elongated region and a tangent to an edge of the substrate; modifying the measured signal on the basis of the angle to generate a modified signal; and at least one of detecting a polishing endpoint or modifying a polishing parameter on the basis of the modified signal. |
