| 摘要 |
The present invention sets one of the following modes, in advance, in mounting information (40 (2)), on the basis of the amount of positional shift between the position of a printed solder and the position of an electrode, as a mounting mode to be executed for each electronic-component-mounting device: a first mounting mode for transporting an electronic component to a corrected mounting position and mounting the same thereon; and a second mounting mode for transporting an electronic component to a mounting position with only the electrode position as a reference therefor, and mounting the same thereon. When performing the component-mounting operation, the electronic component is mounted on a substrate according to the mounting mode set in the mounting information (40 (2)). |
