发明名称 POTTING STRUCTURE AND RESIN INJECTION METHOD
摘要 <p>PROBLEM TO BE SOLVED: To solve such problems that, in a potting structure where an eaves-shaped receiving part is formed on the inner peripheral surface of a casing, and resin is injected therein, with a circuit board mounted on the receiving part, when the circuit board is distorted even a little, the receiving part and the bottom face of the circuit board do not come into contact to easily form a gap, and that the resin flows downward the circuit board through the gap, the downward inflow of resin cannot be prevented completely, and the flow rate cannot be controlled.SOLUTION: A throttle portion is formed between the outer peripheral edge of a circuit board and the inner peripheral surface of a casing, by forming an annular wall on the bottom surface of the casing, and mounting the circuit board on the upper end of the wall. The amount of resin injected from an opening of the casing and intruding around a lower side of the circuit board is regulated by the throttle portion, and the flow of resin intruding around the lower side of the circuit board through the throttle portion is cut off by a contact part of the upper end of the annular wall and the lower face of the circuit board.</p>
申请公布号 JP2014096438(A) 申请公布日期 2014.05.22
申请号 JP20120246329 申请日期 2012.11.08
申请人 RB CONTROLS CO;RINNAI CORP 发明人 ARAKAWA RYOHEI;URASAKI SHINICHI;YOKOYAMA TAKASHI
分类号 H05K3/28;H01L21/56;H01L23/28 主分类号 H05K3/28
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