发明名称 |
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME |
摘要 |
This semiconductor device comprises: a trench that is provided in a semiconductor substrate; an insulating film that covers the inner surface of the trench; and a buried wiring line that fills up the lower part within the trench and is in contact with the insulating film. A barrier insulating film is arranged at least at the interface between the insulating film and the buried wiring line. |
申请公布号 |
WO2014077209(A1) |
申请公布日期 |
2014.05.22 |
申请号 |
WO2013JP80387 |
申请日期 |
2013.11.11 |
申请人 |
PS4 LUXCO S.A.R.L.;NAKATA, SHINICHI |
发明人 |
NAKATA, SHINICHI |
分类号 |
H01L21/8242;C23C16/42;H01L21/316;H01L21/318;H01L21/768;H01L23/532;H01L27/108 |
主分类号 |
H01L21/8242 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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