METHOD AND APPARATUS FOR PROCESSING A WORKPIECE AND AN ARTICLE FORMED THEREBY
摘要
A manufacturing process is applicable to singulating die from a substrate, where the substrate has a layer distinguishable from the substrate by a mechanical property such as brittleness. The process can include providing a workpiece including a substrate and a layer disposed on a first surface, modifying the mechanical property such as by compression, deforming a region of the substrate proximate to the portion of the layer having the modified mechanical property; and fracturing the portion of the layer at a location proximate to the deformed region of the substrate. Also, the process can include propagating a crack through a region of the substrate on a line along the modified portion of the layer. A die formed in this manner is also provided.
申请公布号
WO2014078320(A1)
申请公布日期
2014.05.22
申请号
WO2013US69717
申请日期
2013.11.12
申请人
ELECTRO SCIENTIFIC INDUSTRIES, INC.;CHANG, THOMAS;BOATWRIGHT, THOMAS;HALDERMAN, JONATHAN, D.
发明人
CHANG, THOMAS;BOATWRIGHT, THOMAS;HALDERMAN, JONATHAN, D.