发明名称 |
Dual-Side Illumination Image Sensor Chips and Methods for Forming the Same |
摘要 |
A Dual-Side Illumination (DSI) image sensor chip includes a first image sensor chip configured to sense light from a first direction, and a second image sensor chip aligned to, and bonded to, the first image sensor chip. The second image sensor chip is configured to sense light from a second direction opposite the first direction. |
申请公布号 |
US2014138521(A1) |
申请公布日期 |
2014.05.22 |
申请号 |
US201213683819 |
申请日期 |
2012.11.21 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, L;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
LIU CHIH-MIN;TU HONYIH;CHAO CALVIN YI-PING;HSUEH FU-LUNG |
分类号 |
H01L27/146;H01L31/0232;H01L31/18 |
主分类号 |
H01L27/146 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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