发明名称 Dual-Side Illumination Image Sensor Chips and Methods for Forming the Same
摘要 A Dual-Side Illumination (DSI) image sensor chip includes a first image sensor chip configured to sense light from a first direction, and a second image sensor chip aligned to, and bonded to, the first image sensor chip. The second image sensor chip is configured to sense light from a second direction opposite the first direction.
申请公布号 US2014138521(A1) 申请公布日期 2014.05.22
申请号 US201213683819 申请日期 2012.11.21
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, L;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 LIU CHIH-MIN;TU HONYIH;CHAO CALVIN YI-PING;HSUEH FU-LUNG
分类号 H01L27/146;H01L31/0232;H01L31/18 主分类号 H01L27/146
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