发明名称 METHODS OF FORMING CONDUCTIVE PATTERNS USING INKJET PRINTING METHODS
摘要 A method of forming a conductive pattern includes forming a first partition and a second partition which are spaced apart from each other on a substrate, the first and second partitions defining a trench. The method includes discharging ink into the trench to form ink droplets pinned in a boundary region of the first and second partitions. The method further includes the boundary region including a region between a top side and an outer side of the first and second partitions, the ink including conductive particles. The method includes performing drying and sintering processes to form the conductive pattern in the trench, the conductive pattern including the conductive particles.
申请公布号 US2014138345(A1) 申请公布日期 2014.05.22
申请号 US201313904167 申请日期 2013.05.29
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 HONG JIN-SEOK;HONG YOUNG-KI;KIM JOONG-HYUK;KANG SUNG-GYU;LEE SEUNG-HO
分类号 H05K3/40 主分类号 H05K3/40
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