发明名称 INTEGRATED CIRCUITS AND METHODS FOR FABRICATING INTEGRATED CIRCUITS WITH REDUCED PARASITIC CAPACITANCE
摘要 Integrated circuits and methods for fabricating integrated circuits are provided. In an embodiment, a method for fabricating an integrated circuit includes forming a sacrificial gate structure over a semiconductor substrate. A spacer is formed around the sacrificial gate structure and a dielectric material is deposited over the spacer and semiconductor substrate. The method includes selectively etching the spacer to form a trench between the sacrificial gate structure and the dielectric material. The trench is bounded by a trench surface upon which a replacement spacer material is deposited. The method merges an upper region of the replacement spacer material to enclose a void within the replacement spacer material.
申请公布号 US2014138779(A1) 申请公布日期 2014.05.22
申请号 US201213682331 申请日期 2012.11.20
申请人 GLOBALFOUNDRIES, INC. 发明人 XIE RUILONG;CAI XIUYU;ZHANG XUNYUAN
分类号 H01L29/66;H01L29/40;H01L29/78 主分类号 H01L29/66
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