发明名称 MULTILAYERED CERAMIC CAPACITOR, MOUNTING STRUCTURE OF CIRCUIT BOARD HAVING MULTILAYERED CERAMIC CAPACITOR THEREON, AND PACKING UNIT FOR MULTILAYERED CERAMIC CAPACITOR
摘要 There is provided a multilayered ceramic capacitor, including: a ceramic body having a plurality of dielectric layers laminated therein; an active layer including a plurality of internal electrodes having the respective dielectric layers interposed therebetween; an upper cover layer; a lower cover layer; external electrodes; and a plurality of dummy electrodes, wherein, when A is defined as ½ of an overall thickness of the ceramic body, B is defined as the thickness of the lower cover layer, C is defined as ½ of an overall thickness of the active layer, and D is defined as the thickness of the upper cover layer, a ratio of deviation between a center portion of the active layer and a center portion of the ceramic body, (B+C)/A, satisfies 1.063≰(B+C)/A≰1.745.
申请公布号 US2014138136(A1) 申请公布日期 2014.05.22
申请号 US201313764131 申请日期 2013.02.11
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 AHN YOUNG GHYU;KIM TAE HYEOK;PARK MIN CHEOL;LEE BYOUNG HWA;PARK SANG SOO
分类号 H01G4/30 主分类号 H01G4/30
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