WIRING SUBSTRATE AND PROCESS OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To suppress warpage of a wiring substrate.SOLUTION: A wiring substrate 10 is configured by mounting a plurality of piece substrates 22 to an aluminum frame 11 having rigidity higher than that of a material constituting the piece substrates 22. Accordingly, in a reflow process for mounting an electronic component to the piece substrates 22, even when the piece substrates 22 are heated to temperature exceeding a glass transition temperature, warpage of the piece substrates 22 is effectively suppressed by the frame 11.