IMPROVED INTERCONNECTION METHOD FOR MICRO-IMAGING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing an opto-microelectronic micro-imaging device.SOLUTION: There is provided a method for manufacturing an opto-microelectronic micro-imaging device that includes the steps of: forming a first functional part, based upon a semiconductor-on-insulator type first substrate, which includes a surface layer formed of a single-crystal semiconductor and a base layer arranged right below the surface layer and formed of an electric insulation material; transferring the first function part by forming an upper part plane of the first functional part integrated with a second substrate and positioned on one side face of the first functional part on the opposite side from the base layer; making thin the first substrate on one surface of the first substrate on the opposite side from the second substrate until the base layer is reached and maintaining at least a part of the thickness of the base layer; and forming, on the base layer, a second functional part having at least a second electric connection pad configured to include a pixel electrode and participate in an electric connection between the pixel electrode and a transistor electrode.