| 摘要 |
PROBLEM TO BE SOLVED: To provide a suspension substrate assembly sheet with a circuit which allows for inspection of the vias of a plurality of suspension substrates in a short time while enhancing reliability of inspection results, and to provide a manufacturing method therefor.SOLUTION: A plurality of suspension substrates 100 and an inspection substrate 200 are supported integrally by a support frame. In each suspension substrate 100, lines 123, 125 are formed on a conductive support substrate 110 via a base insulation layer 170. The support substrate 110 and the lines 123, 125 are connected electrically by vias 128, 129 in the base insulation layer 170, respectively. In the inspection substrate 200, a conductor layer 220 is formed on a conductive support substrate 210 via a base insulation layer 240. The support substrate 210 and the conductor layer 220 are connected electrically by a via 221 in the base insulation layer 240. The vias 128, 129 and the via 221 have the same configuration. |
