发明名称 TRANSPARENT CONDUCTIVE ADHESION FILM
摘要 <p>PROBLEM TO BE SOLVED: To provide a transparent conductive adhesion film which attains ductility and flexibility without impairing electromagnetic wave shield performance and conductivity, provides conductivity and electromagnetic wave shielding properties to an object having a complicated shape obtained by integrally molding a plastic material etc., and is excellent in ductility, adhesiveness, conductivity, and transparency.SOLUTION: A transparent conductive adhesive film 1 of the invention includes a lamination structure where a net or grid-like metal mesh member 3 having conductivity in a thickness direction and a surface direction is formed on a surface 2a of a base member 2 formed by a thermoplastic resin. The thickness of the lamination structure ranges from 5μm to 100μm.</p>
申请公布号 JP2014096546(A) 申请公布日期 2014.05.22
申请号 JP20120248797 申请日期 2012.11.12
申请人 SUMITOMO OSAKA CEMENT CO LTD 发明人 ISHIKAWA MASAAKI;OZAKI MASAKI
分类号 H05K9/00;B32B3/24;B32B7/02;B32B27/00;G09F9/00 主分类号 H05K9/00
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