| 摘要 |
<p>PROBLEM TO BE SOLVED: To solve such a problem that when a deep casing having a narrow opening is filled with resin, air remains in the bottom of a casing and may possibly be confined by the resin, and when the air remains, as bubbles, in the resin, the air may possibly escape upward while the resin is curing to form a cavity communicating with the outside, or an electronic component may possibly degrade due to oxygen or moisture in the air of the bubbles, even if the bubbles do not communicate with the outside.SOLUTION: The space in a casing is partitioned to the right and left by providing a longitudinal partition wall in the casing in the vertical direction. A substrate is held in one section and both sections are interconnected in the bottom of the casing, so that the air in the section on the substrate side can be discharged to the outside through the other section, when resin is injected from the section on the side where the substrate is held.</p> |
