发明名称 Wafer Temperature Sensing Methods and Related Semiconductor Wafer
摘要 A method includes measuring a first voltage across a test diode on a semiconductor wafer while injecting a first current into the test diode, measuring a second voltage across the test diode while injecting a second current into the test diode, and determining temperature of a region proximate the test diode according to difference between the first voltage and the second voltage.
申请公布号 US2014139246(A1) 申请公布日期 2014.05.22
申请号 US201213681048 申请日期 2012.11.19
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING, LTD.;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 CHUANG MEI-CHEN;HUANG JUI-CHENG
分类号 G01R31/28;H01L23/544 主分类号 G01R31/28
代理机构 代理人
主权项
地址