发明名称 |
Wafer Temperature Sensing Methods and Related Semiconductor Wafer |
摘要 |
A method includes measuring a first voltage across a test diode on a semiconductor wafer while injecting a first current into the test diode, measuring a second voltage across the test diode while injecting a second current into the test diode, and determining temperature of a region proximate the test diode according to difference between the first voltage and the second voltage. |
申请公布号 |
US2014139246(A1) |
申请公布日期 |
2014.05.22 |
申请号 |
US201213681048 |
申请日期 |
2012.11.19 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING, LTD.;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
CHUANG MEI-CHEN;HUANG JUI-CHENG |
分类号 |
G01R31/28;H01L23/544 |
主分类号 |
G01R31/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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