发明名称 |
FIBER-CONTAINING RESIN SUBSTRATE, DEVICE-MOUNTING SUBSTRATE AND DEVICE-FORMING WAFER, SEMICONDUCTOR APPARATUS, AND METHOD FOR PRODUCING SEMICONDUCTOR APPARATUS |
摘要 |
A fiber-containing resin substrate for collectively encapsulating a semiconductor-device-mounting surface of a substrate on which semiconductor devices are mounted or a semiconductor-device-forming surface of a wafer on which a semiconductor device is formed, including a resin-impregnated fibrous base material which is obtained by impregnating a fibrous base material with a thermosetting resin and semi-curing or curing the thermosetting resin and has a linear expansion coefficient (ppm/° C.) in an X-Y direction of less than 3 ppm, and an uncured resin layer formed of an uncured thermosetting resin on one side of the resin-impregnated fibrous base material. |
申请公布号 |
US2014138856(A1) |
申请公布日期 |
2014.05.22 |
申请号 |
US201314080319 |
申请日期 |
2013.11.14 |
申请人 |
SHIN-ETSU CHEMICAL CO., LTD. |
发明人 |
SEKIGUCHI SUSUMU;SHIOBARA TOSHIO;AKIBA HIDEKI;NAKAMURA TOMOAKI |
分类号 |
H01L23/29;C03C25/36;H01L21/56;H01L21/78 |
主分类号 |
H01L23/29 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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