| 摘要 |
Provided is a semiconductor device having a reduced size. This semiconductor device is provided with: a frame body (3) having an opening (2) at the center portion thereof; an insulating substrate (4), which is disposed in the opening of the frame body, and which has semiconductor chips (8, 9) mounted thereon; lead sections (5a-5e), each of which is at least partially exposed to the opening in the frame body, and each of which has an inclined section that extends at an incline with respect to an end surface that forms the opening; and a bonding wire (10) that is bonded at a position between the lead sections and the semiconductor chips using ultrasonic waves. |
