A resin sheet for use in the formation of a wiring circuit board that can be connected to an electrode formed on a semiconductor chip. The weight loss of the resin sheet is 1.0 wt% or less when the resin sheet is thermally hardened at 180˚C for 1 hour and then immersed in methyl ethyl ketone at a temperature of 20 to 25˚C for 2400 seconds.
