THERMOSETTING EPOXY RESIN COMPOSITION AND OPTICAL SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a thermosetting epoxy resin composition having high strength and flexibility and a semiconductor device using a cured product of the composition as a reflector material.SOLUTION: There is provided a thermosetting epoxy resin composition which comprises: (A) a triazine derivative epoxy resin having at least one epoxy group in one molecule; (B) an epoxy-modified silicone resin; (C) an acid anhydride curing agent (provided that the amount of the (C) component is adjusted so that (the total equivalent number of the epoxy group in the (A) component and the (B) component/the equivalent of the acid anhydride group of the (C) component) is 0.6 to 2.2; (D) a white pigment; and (E) an inorganic filler (provided that the white pigment of the (D) component is excluded).