发明名称 WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a wiring board improved in the degree of freedom of a wiring layout.SOLUTION: The wiring board according to the present invention, which has a laminate in which one or more insulating layers and one or more conductor layers are laminated, is characterized in that: it comprises a plurality of wires formed on the laminate and columnar connection terminals formed directly on at least some of the wires; and the width of the at least some of the wires at positions where the connection terminals are formed is less than the length of the connection terminals in a direction of the width.
申请公布号 JP2014096469(A) 申请公布日期 2014.05.22
申请号 JP20120247052 申请日期 2012.11.09
申请人 NGK SPARK PLUG CO LTD 发明人 NAGAI MAKOTO;MORI SEIJI;ITO TATSUYA
分类号 H01L23/12;H05K3/46 主分类号 H01L23/12
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