| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor module 2 that allows achieving improvement of cooling performance and reduction in size.SOLUTION: A semiconductor module includes: a heat sink 4 and a heat sink 5 stacked in a plate thickness direction X; an IGBT 3 bonded to the heat sink 4; a lead frame 11 bonded to the IGBT 3; a diode 6 bonded to the heat sink 5; and a lead frame 13 bonded to the diode 6. An outside surface of the lead frame 11 in the plate thickness direction X has a cooling surface 11a contactable to a cooling portion 17 cooling the lead frame 11, and an outside surface of the lead frame 13 in the plate thickness direction X has a cooling surface 13a contactable to a cooling portion 18 cooling the lead frame 13. The lead frame 11 and the lead frame 13 have end portions bonded to each other by TIG welding. The heat sinks 4 and 5, the IGBT 3, the diode 6, and the lead frames 11 and 13 are sealed by a molding resin 19. |
