发明名称 |
PROCESS FOR PRODUCING CONDUCTIVE COATING FILM, AND CONDUCTIVE COATING FILM |
摘要 |
An object of the present invention is to provide a conductive coating film formed on a polyimide-based insulating substrate by using a metal powder paste which can exhibit a good conductivity and good adhesion to the insulating substrate. By forming a resin cured layer having a solvent-soluble content of not more than 20% by weight and a thickness of not more than 5μm on a polyimide-based insulating substrate; forming a metal powder-containing coating layer on the resin cured layer by using a metal powder paste; and then subjecting the resulting coating layer to heat treatment with superheated steam, it is possible to obtain a conductive coating film which can exhibit a good conductivity and good adhesion to the insulating substrate. |
申请公布号 |
US2014141238(A1) |
申请公布日期 |
2014.05.22 |
申请号 |
US201214117976 |
申请日期 |
2012.05.17 |
申请人 |
YATSUKA TAKESHI;ITO CHIHO;KAKIHARA YASUO;KIZUMOTO HIROTOSHI;SHOKI KOJI;TOYOBO CO., LTD.;TODA KOGYO CORPORATION |
发明人 |
YATSUKA TAKESHI;ITO CHIHO;KAKIHARA YASUO;KIZUMOTO HIROTOSHI;SHOKI KOJI |
分类号 |
H05K1/09;H05K3/22 |
主分类号 |
H05K1/09 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|