发明名称 PROCESS FOR PRODUCING CONDUCTIVE COATING FILM, AND CONDUCTIVE COATING FILM
摘要 An object of the present invention is to provide a conductive coating film formed on a polyimide-based insulating substrate by using a metal powder paste which can exhibit a good conductivity and good adhesion to the insulating substrate. By forming a resin cured layer having a solvent-soluble content of not more than 20% by weight and a thickness of not more than 5μm on a polyimide-based insulating substrate; forming a metal powder-containing coating layer on the resin cured layer by using a metal powder paste; and then subjecting the resulting coating layer to heat treatment with superheated steam, it is possible to obtain a conductive coating film which can exhibit a good conductivity and good adhesion to the insulating substrate.
申请公布号 US2014141238(A1) 申请公布日期 2014.05.22
申请号 US201214117976 申请日期 2012.05.17
申请人 YATSUKA TAKESHI;ITO CHIHO;KAKIHARA YASUO;KIZUMOTO HIROTOSHI;SHOKI KOJI;TOYOBO CO., LTD.;TODA KOGYO CORPORATION 发明人 YATSUKA TAKESHI;ITO CHIHO;KAKIHARA YASUO;KIZUMOTO HIROTOSHI;SHOKI KOJI
分类号 H05K1/09;H05K3/22 主分类号 H05K1/09
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