发明名称 |
Method for Producing an Electronic Component and Electronic Component |
摘要 |
A method for producing an electronic component comprising barrier layers for the encapsulation of the component comprises, in particular, the following steps: providing a substrate with at least one functional layer, applying at least one first barrier layer on the functional layer via plasma enhanced atomic layer deposition (PEALD), and applying at least one second barrier layer on the functional layer by means of plasma-enhanced chemical vapor deposition (PECVD), where the at least one first barrier layer is applied at a temperature of less than 100° C. |
申请公布号 |
US2014141549(A1) |
申请公布日期 |
2014.05.22 |
申请号 |
US201414163240 |
申请日期 |
2014.01.24 |
申请人 |
SCHMID CHRISTIAN;SCHLENKER TILMAN;ZULL HERIBERT;PAETZOLD RALPH;KLEIN MARKUS;HEUSER KARSTEN;OSRAM OPTO SEMICONDUCTORS GMBH |
发明人 |
SCHMID CHRISTIAN;SCHLENKER TILMAN;ZULL HERIBERT;PAETZOLD RALPH;KLEIN MARKUS;HEUSER KARSTEN |
分类号 |
H01L21/56;H01L31/0216;H01L31/18;H01L51/56 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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