| 摘要 |
<p>PROBLEM TO BE SOLVED: To reduce inductance.SOLUTION: A capacitor device 20 is configured by housing a capacitor in a rectangular-parallelepiped-shaped housing body 21. First semiconductor modules 51 to 53 are bonded to a first mounting surface M1 of the housing body 21 via a first heat exchanger 41. First positive-electrode side input terminals 54 of the first semiconductor modules 51 to 53 and first positive-electrode bus bars 31 are electrically connected on a first pedestal 25 by screw members 58 inserted through the first positive-electrode side input terminals 54 and the first positive-electrode bus bars 31 and threadedly connected to the first pedestal 25. A second semiconductor module is bonded to a second mounting surface M2 of the housing body 21 via a second heat exchanger 81. Second positive-electrode side input terminals of the second semiconductor module and second positive-electrode bus bars 75 are electrically connected on a second pedestal 72 similarly.</p> |
