| 摘要 |
An LED heat-dissipation carrier structure includes a circuit board having at least one LED chip mounted thereon; at least one electrical terminal pin having at an end connected to the LED chip on the circuit board and another end extended in a direction away from a rear side of the LED chip; a bowl-shaped metal-made heat-dissipation carrier for receiving the circuit board and the LED chip therein, and through a bottom of which the electrical terminal pin is extended away from the LED chip; and a light-pervious epoxy filled in the heat-dissipation carrier to completely cover the circuit board and the LED chip. With these arrangements, a watertight and dustproof LED with good heat dissipation ability is formed and suitable for mounting on outdoor signboards, signs or exterior walls of high-rise buildings. |
