| 摘要 |
PROBLEM TO BE SOLVED: To significantly reduce manufacture cost by testing a light-emitting diode immediately after resin molding.SOLUTION: A manufacturing method of a frame structure of a light-emitting diode includes: preparing a metal plate material (100); forming a frame structure of a metal runner and a plurality of metal frames in the metal plate material; applying electric plating to the frame structure (104); continuously affixing a sticking tape onto one surface of the frame structure after electric plating (106) for dicing a connection part of the metal frames (108); forming a resin base in the metal frames but releasing the sticking tape after resin base molding (112); and further performing die bonding (114), wire bonding (116), and resin mold production within the resin base. Finally, before hardening the resin, a power supply is applied to the cut connection part of the metal frames, the LED is turned on, and it is inspected whether luminance and chromaticity contrast are correct or not, thereby improving yield of the light-emitting diode. |
