| 摘要 |
PROBLEM TO BE SOLVED: To suppress deterioration of exhaust efficiency while avoiding mixing of vapors between mutually adjacent vapor deposition heads.SOLUTION: A film deposition apparatus comprises a treatment container, a carrying mechanism, a plurality of vapor deposition heads, partition walls and an exhaust mechanism. The treatment container partitions a treatment chamber for treating a substrate. The carrying mechanism carries a substrate on a carrying path extending in a determined direction in the treatment chamber. The film deposition heads are arranged along a determined direction in the treatment chamber and jet a gas containing vapor deposition material toward a film formation surface of a substrate carried on the carrying path. The exhaust mechanism is connected to individual housing chambers through an exhaust outlet arranged each in the housing chambers. |
