发明名称 APPARATUS AND METHOD OF TESTING SEMICONDUCTOR MODULE
摘要 There are provided an apparatus and a method of testing a semiconductor module capable of easily testing a power semiconductor module including a plurality of switching devices. The apparatus for testing a semiconductor module includes: a main substrate disposed within a case; a jig substrate detachably coupled to the main substrate; and a socket substrate detachably coupled to the jig substrate and having the semiconductor module mounted thereon.
申请公布号 US2014140373(A1) 申请公布日期 2014.05.22
申请号 US201314022893 申请日期 2013.09.10
申请人 C/O SAMSUNG ELECTRO-MECHANICS CO., LTD 发明人 SEO SHANG HOON;KIM SEUNG HWAN;HAM SUK JIN
分类号 G01K7/01 主分类号 G01K7/01
代理机构 代理人
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