发明名称 |
APPARATUS AND METHOD OF TESTING SEMICONDUCTOR MODULE |
摘要 |
There are provided an apparatus and a method of testing a semiconductor module capable of easily testing a power semiconductor module including a plurality of switching devices. The apparatus for testing a semiconductor module includes: a main substrate disposed within a case; a jig substrate detachably coupled to the main substrate; and a socket substrate detachably coupled to the jig substrate and having the semiconductor module mounted thereon. |
申请公布号 |
US2014140373(A1) |
申请公布日期 |
2014.05.22 |
申请号 |
US201314022893 |
申请日期 |
2013.09.10 |
申请人 |
C/O SAMSUNG ELECTRO-MECHANICS CO., LTD |
发明人 |
SEO SHANG HOON;KIM SEUNG HWAN;HAM SUK JIN |
分类号 |
G01K7/01 |
主分类号 |
G01K7/01 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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