| 摘要 |
The invention relates to a method for manufacturing a module (1) having an integrated circuit (electronic) chip, including the following steps: producing a conductive track or pad (2, GND) on an insulating substrate (3) comprising at least one perforation through the insulating substrate opposite at least one ground contact pad (GND); and attaching an integrated circuit chip (4) onto the module using a conductive adhesive, said adhesive extending into said perforation (E, 17) and connecting said ground contact pad (GND) to a surface of the chip. The method is characterized in that it includes the following steps: producing said perforation (E, 17) having a smaller size than a main surface (S) of the chip; and transferring and attaching the chip onto the insulating substrate via the rear surface of the chip. The invention likewise relates to an object having an integrated circuit chip and including the module produced by means of said method. |
