发明名称 Heat-Dissipation Unit with Heat-Dissipation Microstructure and Method of Manufacturing Same
摘要 A heat-dissipation unit with heat-dissipation microstructure and method of manufacturing the same is disclosed. The heat-dissipation unit with heat-dissipation microstructure includes a main body internally defining a chamber; a wick structure formed on an inner surface of the chamber; and at least a SiO2 nano thin film coated on the wick structure. The SiO2 nano thin film is formed of a plurality of SiO2 nanograins, and is coated on the wick structure of the heat-dissipation unit through the sol-gel process. With the at least one layer of SiO2 nano thin film coated on the wick structure, it is able to upgrade the heat dissipation performance of the heat-dissipation unit.
申请公布号 US2014138061(A1) 申请公布日期 2014.05.22
申请号 US201414163648 申请日期 2014.01.24
申请人 ASIA VITAL COMPONENTS CO., LTD. 发明人 CHEN YING-TUNG
分类号 F28D15/04 主分类号 F28D15/04
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