ELECTRONIC COMPONENT MOUNTING SYSTEM

摘要

In the cases where a solder quantity of a soldering section (7) printed on an electrode (6) does not meet a reference quantity, a solder (7*) is additionally applied to a center position (B) of the electrode (6) by means of a control unit (30). A component mounting position (No(R0023)) not having the solder (7*) additionally applied thereto is corrected to a corrected mounting position (D) on a substrate (4) from a component mounting position (C) on the substrate, and an electronic component (5) is mounted at the corrected mounting position (D). The electronic component (5) corresponding to the component mounting position (No(C0134)) having the solder (7*) additionally applied thereto is mounted at the design component mounting position (C) on the aligned substrate (4).