CONDUCTIVE RESILIENT HOLLOW MICROSPHERE, ADHESIVE COMPOSITION, AND ADHESIVE ARTICLES
摘要
<p>A conductive resilient hollow microsphere comprises a conductive layer enclosing a resilient polymeric hollow microsphere. An adhesive composition includes an insulating adhesive component and a plurality of the conductive resilient hollow microspheres. Adhesive articles including the adhesive composition are also disclosed. Methods of making the same are also disclosed.</p>
