发明名称 Light Emitting Device
摘要 <p>Provided is a light emitting device in which stress experienced between the light emitting element and the substrate member can be reduced. The light emitting device 100 includes a substrate member 10 and at least one light emitting element 30. The substrate member 10 has a groove portion 14 defined between adjacent two wiring portions 12 spaced apart from each other. The groove portion 14 includes a first groove portion 141 extending in a third direction that forms at a slanted angle with respect to a first direction, a second groove portion 142 spaced apart from the first groove portion 141 and extending in the third direction, and a third groove portion 143 interconnected with the first groove portion 141 and the second groove portion 142. The light emitting element 30 is disposed over the third groove portion 143.</p>
申请公布号 EP2733751(A1) 申请公布日期 2014.05.21
申请号 EP20130193261 申请日期 2013.11.18
申请人 NICHIA CORPORATION 发明人 MARUTANI, YUKITOSHI
分类号 H01L33/20 主分类号 H01L33/20
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