| 摘要 |
<p>A polishing pad includes at least a polishing layer and a cushion layer, and the polishing layer includes a groove, on a polishing surface, having side surfaces and a bottom surface, wherein at least one of the side surfaces includes a first side surface that extends continuously to the polishing surface and forms an angle ± with the polishing surface, and a second side surface that extends continuously to the first side surface and forms an angle ² with a plane parallel to the polishing surface, the angle ± formed with the polishing surface is larger than 90 degrees, the angle ² formed with the plane parallel to the polishing surface is not smaller than 85 degrees, and the angle ² formed with the plane parallel to the polishing surface is smaller than the angle ± formed with the polishing surface, a bending point depth from the polishing surface to a bending point between the first side surface and the second side surface is not less than 0.4 mm and not more than 3.0 mm, and the cushion layer has a distortion constant of not less than 7.3 × 10 -6 µm/Pa and not more than 4.4 × 10 -4 µm/Pa.</p> |
