| 摘要 |
<p>Disclosed in the present invention is a method for inspecting a solder joint, which can accurately inspect the quality of a solder joint without the influence of the surrounding conditions such as the intervention of surrounding light or the mutual intervention of an adjacent component. The method for inspecting a solder joint comprises as follows: a step of setting a solder joint prediction area at the external side of a lead end unit of a semiconductor component; a step of obtaining the image of the solder joint prediction area; a step of calculating the height of a solder joint within the solder joint prediction area using the image of the solder joint prediction area; and a step of determining the quality of the solder joint by comparing the height of the solder joint within the solder joint prediction area with the preset reference height of the solder joint. Therefore, method for inspecting a solder joint can accurately inspect the quality of the solder joint because of not influenced by image noise due to the surrounding environment, thereby improving the reliability in product inspection and increasing customer satisfaction in products.</p> |
